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Electron Beam and Optical Lithography

Heidelberg MLA150 Maskless Aligner  (arriving 2024)

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The Maskless Aligner MLA 150 is a state-of-the-art maskless lithography tool that is uniquely suited for maskless direct write photolithography on small substrates. The MLA 150 maskless aligner enable precise optical alignment of lithographic patterns to existing features on various types of substrates ranging from small chips to wafers in a user-friendly manner. MLA 150 is indispensable for studies of 2D materials for microelectronics applications that require cleanroom processing at the chip rather than wafer level. It facilitates custom alignment of lithographically patterned electrical leads to nano/microscale quantity of the material present on the chip. 

Specifications/Capabilities

  • Light source: 405 nm diode laser.
  • Resolution: 1  mm 
  • Write speed: 20 min per 4” wafer (1100 mm2 per min)