Publication Type
Conference Paper
Publication Date
Page Numbers
616 to 621
Conference Name
The Applied Power Electronics Conference and Exposition
Conference Location
Long Beach, California, United States of America
Conference Date
-
Abstract
A novel packaging structure for medium power modules featuring power semiconductor switches sandwiched between two symmetric substrates that fulfill electrical conduction and insulation functions is presented. Large bonding areas between dies and substrates allow this packaging technology to offer significant improvements in electrical, thermal performance. Double-sided cooling system was dedicatedly analyzed and designed for different applications.
