Publication Type
Conference Paper
Publication Date
Page Numbers
3529 to 3536
Volume
N/A
Conference Name
Applied Power Electronics Conference (APEC) 2016
Conference Location
Long Beach, California, United States of America
Conference Sponsor
Currently trying to get funding from APEC and University of TN to attend meeting.
Conference Date
-
Abstract
In this paper, a genetic algorithm- (GA-) based approach is discussed for designing heat sinks based on total heat generation and dissipation for a pre-specified size andshape. This approach combines random iteration processesand genetic algorithms with finite element analysis (FEA) to design the optimized heat sink. With an approach that prefers“survival of the fittest”, a more powerful heat sink can bedesigned which can cool power electronics more efficiently. Some of the resulting designs can only be 3D printed due totheir complexity. In addition to describing the methodology, this paper also includes comparisons of different cases to evaluate the performance of the newly designed heat sinkcompared to commercially available heat sinks.
