Abstract
X-ray microbeam measurements of thermal and electromigration-induced strains have
been made at NSLS using white-beam energy dispersive x-ray diffraction, averaging over many
grains, and at APS using white-beam Laue x-ray diffraction, from single grains. Grain-by-grain
deviatoric strain measurements in Al films show wide variation in behavior for different grains
in the films. Room temperature relaxation of residual strains was observed to occur at different
rates for Al films with different bonding layers and substrates. X-ray microbeam measurements
of strain development during electromigration for Cu and Al conductor lines show that strain
gradients do not develop in the copper lines under conditions similar to those for which large
strain gradients have been seen for Al lines
