Skip to main content

Materials

361 - 370 of 505 Results
default image

The use of this invention enables the use of bonding using low-pressure (pressure < 1.7 MPa = 250 psi) sinterable silver as the interconnection or bonding layer medium using sufficiently high-temperature (temperature < 300°C = 500°F), pressurized gas (air or inert gas).&

default image

The invention relates to heating devices and more specifically to heating devices having higher heating efficiencies than the current state of the art. ORNL materials may be heated with the use of an AC induction coil.