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Advanced Component Development Lab

Researcher in a white lab coat, gloves and safety glasses works on power modules next to a wire bonder machine in a lab
Topic:

The Advanced Component Development lab focuses on hardware design and development including wide bandgap semiconductor packaging, gate driver and control electronics, magnetics, and full converter integration, to demonstrate novel and reliable power electronics for grid systems.

Expanded adoption of power electronics for grid modernization requires advances in materials, devices, topologies, and control strategies to support more efficient, reliable interfaces with renewable energy sources, electric vehicles and charging infrastructure, and grid-tied systems. Agile design resources and manufacturing capabilities requiring little lead time are needed to reliably produce these new technologies for system demonstrations.

gloved hands holding a small power module

Uniqueness and capabilities:

  • Development of custom power module packages for new low/medium-voltage, wide-bandgap devices to support low inductance, high-speed switching, and new platform evaluation.
  • Design and manufacturing of inverter/converter subsystems from 24V to 10kV operation in a demonstration pilot line with integration of power, control, and protection capabilities in industrialized packaging.
  • Evaluation of new packaging materials and processes for enhanced thermal, electrical, or reliability performance. 
  • Characterization and reliability testing for power modules for lifetime, electrical, and thermal performance.
  • Magnetics design, assembly, characterization, and electrical testing.
Man with power tool dropping bolts into an electronic machine in a lab with many work tables

Technology resources:

  • Power electronics packaging clean room with vacuum reflow soldering, automated heavy wire bonding, automated dispensing/coating capabilities, and automated copper-copper ultrasonic welder for direct terminal attachment
  • Power cycling test bed (1 – 4 channels) up to 2400A for thermal characterization and lifetime estimation
  • Pilot line for constructing medium voltage inverter/converter systems
  • Power device analyzer with ultra-high current expander, ultra-high voltage expander, and device capacitance measurement for static power module characterization
  • Autonomous Configurable Component Evaluation Tester (ACCEPT) for pulse power and continuous electrical characterization on power electronic components
  • High potential (hipot) testing, and partial discharge testing up to 10kV
  • Magnetics pulse tester with 3 phase extension