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250 degrees C SiC High Density Power Module Development...

by Puqi Ning, Fei Wang, Khai Ngo
Publication Type
Conference Paper
Publication Date
Page Numbers
1275 to 1281
Conference Name
The Applied Power Electronics Conference and Exposition (APEC 2011)
Conference Location
Fort worth, Texas, United States of America
Conference Sponsor
IEEE, PSMA, PELS, and IAS
Conference Date
-