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2.5D Super-Resolution Approaches for X-Ray Computed Tomography-Based Inspection of Additively Manufactured Parts

by Haley E Sullivan, Obaidullah Rahman, Singanallur V Venkatakrishnan, Amir K Ziabari
Publication Type
Conference Paper
Book Title
2024 58th Asilomar Conference on Signals, Systems, and Computers
Publication Date
Page Numbers
308 to 313
Publisher Location
New Jersey, United States of America
Conference Name
ASILOMAR CONFERENCE ON SIGNALS, SYSTEMS, AND COMPUTERS
Conference Location
Pacific Grove, California, United States of America
Conference Sponsor
AMMTO
Conference Date
-

X-ray computed tomography (XCT) is a key tool in non-destructive evaluation of additively manufactured (AM) parts, allowing for internal inspection and defect detection. Despite its widespread use, obtaining high-resolution CT scans can be extremely time consuming. This issue can be mitigated by performing scans at lower resolutions; however, reducing the resolution compromises spatial detail, limiting the accuracy of defect detection. Super-resolution algorithms offer a promising solution for overcoming resolution limitations in XCT reconstructions of AM parts, enabling more accurate detection of defects. While 2D super-resolution methods have demonstrated state-of-the-art performance on natural images, they tend to under-perform when directly applied to XCT slices. On the other hand, 3D super-resolution methods are computationally expensive, making them infeasible for large-scale applications. To address these challenges, we propose a 2.5D super-resolution approach tailored for XCT of AM parts. Our method enhances the resolution of individual slices by leveraging multi-slice information from neighboring 2D slices without the significant computational overhead of full 3D methods. Specifically, we use neighboring low-resolution slices to super-resolve the center slice, exploiting inter-slice spatial context while maintaining computational efficiency. This approach bridges the gap between 2D and 3D methods, offering a practical solution for high-throughput defect detection in AM parts.