Publication Type
Conference Paper
Book Title
2020 IEEE Applied Power Electronics Conference and Exposition (APEC)
Publication Date
Page Numbers
2741 to 2747
Conference Name
IEEE Applied Power Electronics Conference and Exposition (APEC)
Conference Location
New Orleans, Louisiana, United States of America
Conference Sponsor
IEEE
Conference Date
-
Abstract
Next generation power modules demand increased heat extraction capability along with reduced weight and volume. In this paper, thermally annealed pyrolytic graphite (TPG) is analyzed and compared with conventional materials used in power modules for thermal management. Fundamental properties of TPG are explained and compared with commonly used materials in power module heat spreaders and substrates. The encapsulated TPG based heat spreader is manufactured and compared with bulk copper in simulation and experimental based analysis. The results show that encapsulated TPG based heat spreader achieves more than 50% reduction in thermal resistance along with 48% reduction in weight in the heat spreader layer.
