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DEFECT SELECTIVE ETCHING OF THICK ALN LAYERS GROWN ON 6H-SIC SEEDS - A TRANSMISSION ELECTRON MICROSCOPY STUDY...

by Luke Nyakiti, Jharna Chaudhari, Edward A Kenik, Peng Lu, J Edgar
Publication Type
Conference Paper
Book Title
Nitrides and Related Bulk Materials
Publication Date
Volume
1040E
Publisher Location
Warrendale, Pennsylvania, United States of America
Conference Name
Materials Research Society
Conference Location
Boston, Massachusetts, United States of America
Conference Date

In the present study, the type and densities of defects in AlN crystals grown on 6H-SiC seeds by the sublimation-recombination method were assessed. The positions of the defects in AlN were first identified by defect selective etching (DSE) in molten NaOH-KOH at 400�C for 2 minutes. Etching produced pits of three different sizes: 1.77 �m, 2.35 �m , and 2.86 �m. The etch pits were either aligned together forming a sub-grain boundary or randomly distributed. The smaller etch pits were either isolated or associated with larger etch pits. After preparing crosssections of the pits by the focused ion beam (FIB) technique, transmission electron microscopy (TEM) was performed to determine which dislocation type (edge, mixed or screw) produced a specific etch pit sizes. Preliminary TEM bright field and dark field study using different zone
axes and diffraction vectors indicates an edge dislocation with a Burgers vector 1/3[1120] is associated with the smallest etch pit size.