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Direct Envelope Modeling of Load-Resonant Inverter for Wireless Power Transfer Applications...

by Veda Prakash Galigekere, Rong Zeng, Jason L Pries, Omer C Onar, Gui-jia Su
Publication Type
Conference Paper
Journal Name
IEEE Applied Power Electronics Conference and Exposition (APEC)
Book Title
2020 IEEE Applied Power Electronics Conference and Exposition (APEC)
Publication Date
Page Numbers
3195 to 3199
Issue
Proceeding
Conference Name
2020 IEEE Applied Power Electronics Conference and Exposition (APEC)
Conference Location
New Orleans, Louisiana, United States of America
Conference Sponsor
IEEE
Conference Date
-

This paper presents the application of direct envelope modeling technique to primary side LCC tuned resonant wireless power transfer system. The method adapted here decomposes the HF resonant inverter output to a fundamental component and two dominant sidebands. The small-signal dutycycle-to-primary-coil-current-envelope transfer function of a primary side LCC tuned WPT system is then derived as the summation of the responses to the fundamental and the sideband components. The theoretical and simulation results are in good agreement indicating the validity of the approach to be applied to WPT systems.