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Fabrication and Evaluation of a High Performance SiC Inverter for Wireless Power Transfer Applications...

by Omer C Onar, Steven L Campbell, Puqi Ning, John M Miller, Zhenxian Liang
Publication Type
Conference Paper
Publication Date
Page Numbers
125 to 130
Conference Name
The 1st IEEE Workshop on Wide Bandgap Power Devices and Applications
Conference Location
Columbus, Indiana, United States of America
Conference Sponsor
IEEE, IEEE-PELS, IEEE-EDS, PSMA
Conference Date
-

In this study, a high power density SiC high efficiency wireless power transfer converter system via inductive coupling has been designed and developed. The detailed power module design, cooling system design and power stage development are presented. The successful operation of rated power converter system demonstrates the feasible wireless charging plan. One of the most important part of this study is the wind bandgap devices packaged at the Oak Ridge National Laboratory (ORNL) using the in-house packaging technologies by employing the bare SiC dies acquired from CREE, which are rated at 50 A / 1200 V each. These packaged devices are also inhouse tested and characterized using ORNL’s Device
Characterization Facility. The successful operation of the proposed inverter is experimentally verified and the efficiency and operational characteristics of the inverter are also revealed.