Publication Type
Conference Paper
Journal Name
IEEE Energy Conversion Congress and Exposition (IEEE ECCE)
Book Title
2020 IEEE Energy Conversion Congress and Exposition (ECCE)
Publication Date
Page Numbers
4017 to 4023
Conference Name
IEEE Energy Conversion Congress and Exposition (IEEE ECCE) 2020
Conference Location
Detroit, Michigan, United States of America
Conference Sponsor
IEEE
Conference Date
-
Abstract
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation. This article proposes a design optimization method for liquid-cooled heat sinks that use a Fourier analysis-based tool and an evolutionary optimization algorithm to optimize the heat sink geometry for specified objectives. The optimized heat sink geometry is then compared with state-of-the-art solutions in literature based on finite element analysis of different designs. The proposed methodology can develop complex geometries that outperform the conventional heat sink geometries.
