Publication Type
Journal
Journal Name
RSC Advances
Publication Date
Page Numbers
15373 to 15377
Volume
12
Issue
24
Abstract
Thermal insulation materials are highly desirable for several applications ranging from building envelopes to thermal energy storage systems. A new type of low-cost insulation material called hollow silica particles (HSPs) was recently reported. The present work presents an HSP-based stand-alone composite that has very low thermal conductivity and is highly stable to moisture.
