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Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules...

by Zhenxian Liang, Puqi Ning, Fei Wang, Laura D Marlino
Publication Type
Conference Paper
Publication Date
Conference Name
IEEE Energy Conservation Congress & Exposition 2012 (ECCE2012)
Conference Location
Raleigh, North Carolina, United States of America
Conference Date
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