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Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules...

by Zhenxian Liang, Puqi Ning, Fei Wang, Laura D Marlino
Publication Type
Conference Paper
Publication Date
Page Numbers
438 to 443
Conference Name
The 4th IEEE Energy Conversion Congress and Exposition (ECCE12)
Conference Location
Raleigh, North Carolina, United States of America
Conference Date
-