Publication Type
Conference Paper
Book Title
2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC)
Publication Date
Page Numbers
783 to 788
Conference Name
2012 27th Annual IEEE Applied Power Electronics Conference and Exposition (APEC)
Conference Location
Orlando, Florida, United States of America
Conference Date
-
Abstract
With smart grid integration, there is a need to characterize reliability of a power system by including reliability of power semiconductors in grid related applications. In this paper, the reliability of IGBTs in a STATCOM application is presented for two different applications, power factor correction and harmonic elimination. The STATCOM model is developed in EMTP, and analytical equations for average conduction losses in an IGBT and a diode are derived and compared with experimental data. A commonly used reliability model is used to predict reliability of IGBT.
