Abstract
Efficient thermal management of power electronics systems is crucial for higher reliability. With the miniaturization of systems, high-loss-density electronics require cooling systems that can extract a large amount of heat. This study explored a liquid-jet-impingement-based direct substrate cooling system for single-sided and double-sided cooling to improve heat extraction efficiency and improve the power density by reducing the volume and mass. The cooling system was implemented for a SiC-based direct bonded copper substrate. Numerical simulations were performed to determine the effects of nozzle diameter, the number of nozzles, and nozzle array orientation on single-sided cooling and thermal performance gain over double-sided cooling. A novel manifold design was proposed that reduced the volume and mass of the manifold and still achieved the target power density. The performance of the proposed design was compared with the pin-fin-based cooling system used in the BMW I3 module, and a comparative analysis was done.
