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Thermal Integration of a High Power Polyphase Inductive Coil Assembly

by Andrew P Foote, Erdem Asa, Omer C Onar
Publication Type
Conference Paper
Book Title
2024 IEEE Transportation Electrification Conference and Expo (ITEC)
Publication Date
Page Numbers
1 to 5
Publisher Location
New Jersey, United States of America
Conference Name
IEEE Transportation Electrification Conference and Expo (ITEC)
Conference Location
Rosemont, Illinois, United States of America
Conference Sponsor
IEEE, IEEE IAS, IEEE PELS, IEEE VTS, IEEE PES
Conference Date
-

As inductive wireless power transfer reaches higher power levels; thermal management becomes essential. To address these concerns, past works have demonstrated the benefit of encapsulating coil assemblies with thermally conductive materials and integrating backside liquid cooling into coil assemblies. This work adds to these developments by considering the thermal analysis and construction of a liquid-cooled high power polyphase wireless power transfer ground assembly intended for long duration operation at high power levels, aiming towards hundreds of kW or even 1 MW.