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Publication

Thermal Properties of Wood-Derived Copper-Silicon Carbide Compsites Fabricated Via Electrodeposition...

by Kristen E Pappacena, M. T. Johnson, Hsin Wang, Wallace D Porter, K. Faber

Publication Type

Journal

Journal Name

Composites Science and Technology

Publication Date

March, 2010

Page Numbers

478 to 484

Volume

70

Issue

10

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