Skip to main content
SHARE
Publication

Thermomechanical Reliability Investigation of Large Temperature Excursions in Power Electronics Packages...

by Puqi Ning, Fei Wang, Khai Ngo
Publication Type
Conference Paper
Publication Date
Page Numbers
319 to 324
Conference Name
IEEE Energy Conversion Congress & Exposition (ECCE 2011)
Conference Location
Phoenix, Arizona, United States of America
Conference Date
-