Skip to main content
SHARE
Publication

Understanding middle-point inductance's effect on switching transients for multi-chip SiC package design with P-cell/N-cell concept

Publication Type
Conference Paper
Book Title
2018 IEEE Applied Power Electronics Conference and Exposition (APEC)
Publication Date
Page Numbers
1742 to 1749
Issue
0
Publisher Location
New Jersey, United States of America
Conference Name
2018 IEEE Applied Power Electronics Conference and Exposition (APEC)
Conference Location
San Antonio, Texas, United States of America
Conference Sponsor
IEEE Industry Applications Society; IEEE Power Electronics Society; Power Sources Manufacturers Association
Conference Date
-

Middle-point inductance L_middle can be introduced in power module designs with P-cell/N-cell concept. In this paper, the effect of middle-point inductance on switching transients is analyzed first using frequency domain analysis. Then a dedicated multiple-chips power module is fabricated with the capability of varying L_middle, and extensive switching tests are conducted to evaluate the device’s switching performance at different L_middle. Experiment results show that as L_middle changes, different voltage stresses are imposed on the active switch and anti-parallel diode. For lower MOSFET’s turn-off, as L_middle goes up, the maximum voltage of lower MOSFET increases; however, the maximum voltage of anti-parallel diode decreases significantly. In addition to voltage spikes, it is observed that the active MOSFET’s turn-on loss will decrease at higher values of L_middle while its turn-off loss will increase. Detailed analysis of this loss variation is presented. The analysis and experiment results will provide design guidelines for multiple-chips power module package design with P-cell/N-cell concept.