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Publication

Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material...

by Andrew A Wereszczak, Zhenxian Liang, Mattison K Ferber, Laura D Marlino
Publication Type
Conference Paper
Publication Date
Page Numbers
178 to 187
Conference Name
International Conference on High Temperature Electronics (HiTEC 2014)
Conference Location
Albuquerque, New Mexico, United States of America
Conference Date