Publication Type
Journal
Journal Name
Journal of Electronic Materials
Publication Date
Page Numbers
2374 to 2377
Volume
47
Issue
4
Abstract
Polycrystalline Cu3BiS3 was synthesized and densified using hot pressing in order to investigate the physical properties of this material. Both the thermal conductivity and the Seebeck coefficient of Cu3BiS3 are reported for the first time in order to investigate the thermoelectric properties of this material. The ultralow thermal conductivity coupled with the relatively high Seebeck coefficient, 0.17 W/m-K and 540 μV/K at room temperature, respectively, suggest Cu3BiS3 may show promise for thermoelectric applications.
