Materials

The present invention comprises a method to produce carbon fiber from relatively low-cost precursors from polyolefins and their compounded derivatives.

Many integrated circuit devices such as computer chips rely on interconnects made of copper to electrically join them to a power source and/or other devices.  Surface electromigration in copper interconnects is the primary mode of failure in computer chip circuits. 

The emission of carbon dioxide (CO2) from burning of fossil fuels has received worldwide attention because of its implication in climate change, which threatens economies and environments.

Templated carbon materials have recently received tremendous attention due to energy storage and separations applications. Hierarchical structures are ideal for increased mass-transport throughout the carbon material.

This invention reports a novel synthetic approach towards the design of air electrodes for metal-air batteries. Specifically, we employ a hybrid approach that incorporates a structural and a compositional gradient along the spatial dimension or thickness of the air cathode.

The present invention relates to high performance low cost thermoelectric materials for electrical power generation. The new thermoelectric materials are stable cubic compounds having optimum performance above room temperature.

Practices are described for preparing fine-grain stress-tolerant, brittle, doped semiconductor thermoelectric elements better suited to withstand thermal and mechanical loads without cracking or fracture.

This invention disclosure describes the use ORNL’s superhydrophobic powders in the evaporative desalination process.

This invention is directed to a process of manufacturing of complex three dimensional devices.  The invention process employs a technology to produce a wide variety of functional nanomaterials (magnetic, optical, electrical...).  The nanomaterials are then deposited,

The invention relates to a sputtering target for carrying out a Physical Vapor Deposition (PVD) coating process and more specifically, a PVD coating process where the sputtering target is sputtered by bombardment with gas atoms and/or ions and a layer consisting of a plurality