![Wavy photo representing high performance computing](/sites/default/files/styles/featured_square_large/public/2024-09/ORNL%20BG03%5B84%5D.jpg?h=50f775af&itok=2RkMJksc)
DOE, ORNL announce opportunity to define future of High-Performance Computing
A new concept in metallic alloy design – called “high-entropy alloys” - has yielded a multiple-element material that not only tests out as one of the toughest on record, but, unlike most materials, the toughness as well as the strength and ductility