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Researcher
- Brian K Post
- Peeyush Nandwana
- Sudarsanam Babu
- Yong Chae Lim
- Ali Passian
- Beth L Armstrong
- Hsuan-Hao Lu
- Joseph M Lukens
- Jun Qu
- Kenton Blane Fillingim
- Lauren E Heinrich
- Meghan E Lamm
- Rangasayee Kannan
- Ryan R Dehoff
- Thomas A Feldhausen
- Yousub Lee
- Zhili Feng
- Aaron W Werth
- Adam G Stevens
- Alexander Miloshevsky
- Alice E Perrin
- Amit Shyam
- Ben W Lamm
- Chad Steed
- Christopher C Ledford
- Claire E Marvinney
- Debangshu Mukherjee
- Emilio C Piesciorovsky
- Gabriel M Veith
- Gary Hahn
- Glenn R Romanoski
- Govindarajan Muralidharan
- Jian Chen
- Jiheon Jun
- Joel A Dawson
- Joel M Asiamah
- Junghoon Chae
- Khryslyn G Araño
- Marm B Dixit
- Md Inzamam Ul Haque
- Michael M Kirka
- Milton N Ericson
- Muneer Alshowkan
- Nicholas A Peters
- Olga S Ovchinnikova
- Pablo Moriano
- Patxi Fernandez-Zelaia
- Priyanshi Agrawal
- Ramanan Sankaran
- Raymond C Borges Hink
- Rishi R Pillai
- Rob C Jordan
- Rob G Moore II
- Roger G Miller
- Rose A Montgomery
- Samudra Dasgupta
- Sarah M Graham
- Shajjad S Chowdhury
- Srikanth B Yoginath
- Thomas R Muth
- Tolga Aytug
- Travis S Humble
- Varisara Tansakul
- Venugopal K Varma
- Vimal A Ramanuj
- Wenjun Ge
- William H Peter
- Yan-Ru Lin
- Ying Yang
- Yukinori Yamamoto
QVis is a visual analytics tool that helps uncover temporal and multivariate variations in noise properties of quantum devices.
Finite element (FE) numerical computation method is widely used to facilitate the design and optimization of manufacturing processes using two types of solvers, implicit and explicit.
ORNL's fully on-chip CMOS-fabricated integrated photonic circuit can generate polarization or frequency entangled photons for use in quantum communications and networking.
This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.
Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.
New demands in electric vehicles have resulted in design changes for the power electronic components such as the capacitor to incur lower volume, higher operating temperatures, and dielectric properties (high dielectric permittivity and high electrical breakdown strengths).
Photonic hyperentanglement involves pairs of photons entangled in multiple degrees of freedom (DoF), which hold promise for quantum communication protocols. However, the frequency DoF has received less attention due to constraints in evaluating such hyperentangled states.
High strength, oxidation resistant refractory alloys are difficult to fabricate for commercial use in extreme environments.
Ceramic matrix composites are used in several industries, such as aerospace, for lightweight, high quality and high strength materials. But producing them is time consuming and often low quality.
Power utilities are increasingly deploying intelligent electronic devices inside and outside substations. Sharing data in substations between utility-owned devices and customer-owned distributed energy resources (DERs) risks the integrity and confidentiality of that data.