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Researcher
- Adam M Guss
- Brian K Post
- Peeyush Nandwana
- Sudarsanam Babu
- Yong Chae Lim
- Beth L Armstrong
- Biruk A Feyissa
- Jun Qu
- Kenton Blane Fillingim
- Lauren E Heinrich
- Meghan E Lamm
- Rangasayee Kannan
- Ryan R Dehoff
- Thomas A Feldhausen
- Yousub Lee
- Zhili Feng
- Adam G Stevens
- Alice E Perrin
- Amit Shyam
- Andrzej Nycz
- Ben W Lamm
- Carrie A Eckert
- Christopher C Ledford
- Gabriel M Veith
- Glenn R Romanoski
- Govindarajan Muralidharan
- Harold A Walters
- Jay D Huenemann
- Jian Chen
- Jiheon Jun
- Khryslyn G Araño
- Kuntal De
- Marm B Dixit
- Michael M Kirka
- Nandhini Ashok
- Patxi Fernandez-Zelaia
- Priyanshi Agrawal
- Rishi R Pillai
- Rob G Moore II
- Roger G Miller
- Rose A Montgomery
- Samuel C Leach
- Sarah M Graham
- Shajjad S Chowdhury
- Thomas R Muth
- Tolga Aytug
- Udaya C Kalluri
- Venugopal K Varma
- Vincent C Paquit
- Wellington Muchero
- William H Peter
- Xiaohan Yang
- Yan-Ru Lin
- Yasemin Kaygusuz
- Ying Yang
- Yukinori Yamamoto
Finite element (FE) numerical computation method is widely used to facilitate the design and optimization of manufacturing processes using two types of solvers, implicit and explicit.
This technology can activate gene expression in a time- and dose-dependent manner in the thermophilic bacterium Clostridium thermocellum. This system will mediate inducible gene expression for strain engineering in C.
The technologies described provides for the upcycling of mixed plastics to muonic acid and 3-hydroxyacids.
This invention is for bacterial strains that can utilize lignocellulose sugars. This will improve the efficiency of bioproduct formation in these strains and reduce the greenhouse-gas emission of an industrial bi
Orphan bHLH enhances plant biomass gain. The orphan bHLH gene has an exclusive nuclear subcellular localization with a transcriptional activator activity.
This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.
Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.
New demands in electric vehicles have resulted in design changes for the power electronic components such as the capacitor to incur lower volume, higher operating temperatures, and dielectric properties (high dielectric permittivity and high electrical breakdown strengths).
High strength, oxidation resistant refractory alloys are difficult to fabricate for commercial use in extreme environments.