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Researcher
- Omer C Onar
- Samuel C Hollifield
- Vivek A Sujan
- Ahmed Arabi Hassen
- Burak Ozpineci
- Erdem Asa
- Gui-Jia Su
- Meghan E Lamm
- Mostak Mohammad
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- Amit Shyam
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- Christopher Ledford
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- David Nuttall
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- Dustin B Gilmer
- Emrullah Aydin
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- Hong Wang
- Isaac C Sikkema
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- Joseph D Rendall
- Joseph V Olatt
- Jun Qu
- Kevin D Spakes
- Kunal Mondal
- Lilian V Swann
- Lingxiao Xue
- Mahim Mathur
- Michael M Kirka
- Mingyan Li
- Oscar A Martinez
- Pablo Moriano
- Patxi Fernandez-Zelaia
- Phani Ratna Vanamali Marthi
- Rafal P Wojda
- Ritu Sahore
- Robert A Bridges
- Robert N Stewart
- Ryan R Dehoff
- Steven E Bullock
- Subho Mukherjee
- Suman Debnath
- Tolga Aytug
- Trevor G Aguirre
- Vandana P Rallabandi
- Yan-Ru Lin
- Ying Yang
- Yong Chae Lim
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One of the most important features of a BMS is the ability to estimate the state of charge (SoC).
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Technologies directed to trace-twisting/transposition-based PCB winding design are described.
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Technologies directed to rotor current prediction in rotary transformer applications are described.
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Technologies directed to a resonant tuning network for rotary transformer applications are described.
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Technologies directed to a rotary transformer with integrated power electronics are described.
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Welding high temperature and/or high strength materials for aerospace or automobile manufacturing is challenging.
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In the proposed design, a 3d design method is proposed to design 3d heat sinks which would allow non uniform flow along the flow direction while the predecessor design and majority of the conventional designs are extrusion based design with straight flow path.
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We have designed, manufactured, and tested the two-layer structured cathodes with solid polymer electrolytes. The cathodes are designed to have two layers: denser "energy layer" facing the metallic current collector and high porosity/low tortuosity "power layer".
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A method is proposed to address the real-time tracking and monitoring of Radioactive/Nuclear materials in transportation using Smart Packaging (SP), together with 3-D printing and Ad-Hoc networking.
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The solution proposed here is a modified carbon-based tile face that is mechanically combined with an insulative backing. The tile face is based on a material architecture to minimize weight and thermal conductivity while maximizing thermal stability.