Updated software improves slicing for large-format 3D printing
Oak Ridge National Laboratory researchers have created a technology that more realistically emulates user activities to improve cyber testbeds and ultimately prevent cyberattacks.
A research team at Oak Ridge National Laboratory have 3D printed a thermal protection shield, or TPS, for a capsule that will launch with the Cygnus cargo spacecraft as part of the supply mission to the International Space Station.
Deborah Frincke, one of the nation’s preeminent computer scientists and cybersecurity experts, serves as associate laboratory director of ORNL’s National Security Science Directorate. Credit: Carlos Jones/ORNL, U.S. Dept. of Energy
Oak Ridge National Laboratory researchers, in collaboration with Cincinnati Inc., demonstrated the potential for using multimaterials and recycled composites in large-scale applications by 3D printing a mold that replicated a single facet of a
Oak Ridge National Laboratory researchers combined additive manufacturing with conventional compression molding to produce high-performance thermoplastic composites reinforced with short carbon fibers.
Researchers at Oak Ridge National Laboratory developed self-healing elastomers that demonstrated unprecedented adhesion strength and the ability to adhere to many surfaces, which could broaden their potential use
Six scientists at the Department of Energy’s Oak Ridge National Laboratory were named Battelle Distinguished Inventors, in recognition of obtaining 14 or more patents during their careers at the lab.
The University of Texas at San Antonio (UTSA) has formally launched the Cybersecurity Manufacturing Innovation Institute (CyManII), a $111 million public-private partnership.
Four research teams from the Department of Energy’s Oak Ridge National Laboratory and their technologies have received 2020 R&D 100 Awards.
ORNL and Department of Energy officials dedicated the launch of two clean energy research initiatives that focus on the recycling and recovery of advanced manufacturing materials and on connected and